1-50871-8, IC & Component Sockets MIN-SPR W/H AU SER-5
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см. техническую документацию
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Описание
Соединители\Установочные панели для ИС и компонентов
Установочные панели для ИС и компонентов MIN-SPR W/H AU SER-5
Технические параметры
| Другие названия товара № | 1-50871-8 |
| Категория продукта | Установочные панели для ИС и компонентов |
| Подкатегория | IC Component Sockets |
| Размер фабричной упаковки | 2000 |
| Тип продукта | IC Component Sockets |
| Торговая марка | TE Connectivity / AMP |
| 3D Drawings | http://www.te.com/commerce/DocumentDelivery/DDECon |
| Accepts Pin Diameter | 0.056"" ~ 0.065"" (1.42mm ~ 1.65mm) |
| Contact Finish | Gold |
| Contact Finish Thickness | 30.0Вµin (0.76Вµm) |
| Contact Material | Beryllium Copper |
| ECCN | EAR99 |
| Environmental Information | http://www.te.com/commerce/alt/SinglePartSearch.do |
| Features | Open Bottom |
| Flange Diameter | 0.118"" (3.00mm) |
| HTSUS | 8536.69.4040 |
| Length - Overall | 0.288"" (7.32mm) |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Hole Diameter | 0.101"" ~ 0.103"" (2.57mm ~ 2.62mm) |
| Operating Temperature | -65В°C ~ 125В°C |
| Package | Bulk |
| RoHS Status | RoHS Compliant |
| Socket Depth | 0.275"" (6.99mm) |
| Tail Type | No Tail |
| Termination | Solder |
| Circuit Application | Power & Signal |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector System | Cable-to-Board |
| Contact Base Material | Beryllium Copper |
| Contact Current Rating (Max) | 7.5 A |
| Contact Mating Area Plating Thickness | 30 µm |
| Contact Spring Plating Material | Gold |
| Contact Spring Plating Thickness | 0.762 µm |
| Contact Transmits (Typical) | Signal(Data)/Power |
| Contact Type | Socket |
| Hole Size (Recommended) | 2.56 mm |
| Insertion Method | Hand/Semi-Automatic |
| Mating Pin Diameter Range | 1.42-1.65 mm |
| Operating Temperature Range | -65-125 °C |
| Packaging Method | Bag, (Loose Piece) |
| Packaging Quantity | 2000 |
| PCB Thickness (Recommended) | 0.79-3.18 mm |
| Product Type | Contact |
| Profile | Zero |
| Sealable | No |
| Sleeve Material | Copper |
| Sleeve Plating Material | Gold Flash over Nickel |
| Sleeve Style | Open Bottom |
| Socket Length | 7.32 mm |
| Socket Type | Discrete |
| Solder Process Feature | None |
| Spring Material | Beryllium Copper |
| Termination Method to Printed Circuit Board | Through Hole-Press-Fit |
| Termination Method to Wire & Cable | Solder |
| Wire Size | 16-14 AWG |
| Wire/Cable Type | Discrete Wire |
| Вес, г | 0.106 |
Техническая документация
Выбор кримпера для обжима клемм
pdf, 200 КБ
