SP2000-0.015-AC-1212, Thermal Interface Products Sil-Pad, 12"x12" Sheet, 0.015" Thickness, 1 Side Adhesive, IDH 2165822

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD ® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD ® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.