SP400-0.007-00-54, Thermal Interface Products Sil-Pad, 0.007" Thickness, 19.05x12.7mm, Sil-Pad TSP900/400, IDH 2191243

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD ® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD ® materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible.