TS391AX, Solder Paste No-Clean 15g Sn63/Pb37 T4
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Описание
Tools & Supplies\Soldering\Solder
TS391 No-Clean Solder PasteChip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.
Технические параметры
Alloy: | Sn63/Pb37 |
Brand: | Chip Quik |
Contains Lead: | Yes |
Description/Function: | Thermally stable solder paste 15g syringe |
Manufacturer: | Chip Quik |
Package Type: | Syringe |
Product Category: | Solder |
Product Type: | Solder |
Product: | Solder |
Subcategory: | Solder & Equipment |
Type: | Paste, No Clean |
Вес, г | 46.05 |
Техническая документация
Datasheet TS391AX
pdf, 103 КБ
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