W25M512JWBIQ, Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector,

Serial MCP Flash Portfolio with SpiStack®

Winbond Serial MCP Flash Portfolio with SpiStack® is based on the popular W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV. The portfolio offers flexible memory density and reliability combinations for the low pin count package, and Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput. The series consists of a 1.8V NAND Flash Memory device combined with a 1.8V Low Power SDRAM device. MCP is an all-in-one package that provides an effective solution for saving Printed Circuit Board (PCB) space. This benefit becomes more critical in small PCBs for modules and space-critical designs particularly for mobile and portable applications.