2309407-1, Сокет DDR4 серия SOMINN 260 контактов шаг 0.5 мм для поверхностного монтажа
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Описание
Разъемы, Соединители / Интерфейсные разъемы / Memory Card, SIM, DIMM разъемы
Сокет DDR4 серия SOMINN 260 контактов шаг 0.5 мм для поверхностного монтажа
Технические параметры
| Brand: | TE Connectivity/Alcoswitch |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold |
| Current Rating: | 500 mA |
| Factory Pack Quantity: Factory Pack Quantity: | 450 |
| Housing Material: | Thermoplastic(TP) |
| Insulation Resistance: | 250 MOhms |
| Manufacturer: | TE Connectivity |
| Maximum Operating Temperature: | +85 C |
| Minimum Operating Temperature: | -55 C |
| Mounting Angle: | Right Angle |
| Mounting Style: | PCB Mount |
| Number of Positions: | 260 Position |
| Pitch: | 0.5 mm |
| Product Category: | DIMM Connectors |
| Product Type: | DIMM Connectors |
| Product: | SODIMM |
| Subcategory: | Memory Connectors & Sockets |
| Termination Style: | SMD/SMT |
| Type: | DDR4 |
| Voltage Rating: | 1.2 V |
| Center Key | Offset Left |
| Center Post | Without |
| Centerline (Pitch) | 0.5 mm, (2.1 mm) |
| Circuit Application | Power |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector Mounting Type | Board Mount |
| Connector Profile | Low |
| Connector System | Cable-to-Board |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | 0.5 A |
| Contact Mating Area Plating Material | Gold Flash |
| DRAM Type | Small Outline(SO) |
| DRAM Voltage | 1.2 V |
| Ejector Location | Both Ends |
| Ejector Type | Locking |
| Housing Color | Black |
| Housing Material | High Temperature Thermoplastic |
| Insertion Style | Cam-In |
| Keying | Standard |
| Latch Material | High Temperature Thermoplastic |
| Module Key Type | Offset Left |
| Module Orientation | Right Angle |
| Number of Keys | 1 |
| Number of Positions | 260 |
| Number of Rows | 2 |
| Operating Temperature Range | -55-85 °C |
| Packaging Method | Tape & Reel |
| Packaging Quantity | 900 |
| PCB Contact Termination Area Plating Material | Gold Flash |
| PCB Mount Retention | With |
| PCB Mount Retention Type | Solder Peg |
| PCB Mounting Style | Surface Mount |
| Product Type | Socket |
| Retention Post Location | Both Ends |
| Retention Post Material | Stainless Steel |
| Row-to-Row Spacing | 8.2 mm |
| Sealable | No |
| SGRAM Voltage | 1.2 V |
| Socket Style | SO DIMM |
| Socket Type | Memory Card |
| Stack Height | 4 mm |
| UL Flammability Rating | UL 94V-0 |
| Body Orientation | Right Angle |
| Contact Material | Copper Alloy |
| Contact Plating | Gold Flash, Nickel Plated(Under Plated) |
| Current Rating | 500.0mA |
| Gender | Female |
| Latching | Yes |
| Maximum Contact Resistance | 50.0mΩ |
| Maximum Operating Temperature | +85°C |
| Memory Socket Type | DIMM Socket |
| Minimum Operating Temperature | +85°C |
| Mounting Type | Surface Mount |
| Number of Contacts | 260 |
| Pitch | 0.5mm |
| Row Spacing | 8.2mm |
| SDRAM Type | SO |
| Series Number | 2309407 |
| Termination Method | Solder |
| Voltage Rating | 25 V |
| Вес, г | 2.72 |
Техническая документация
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