374424B00035G, Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3°C/W Black Anodized
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3506 шт., срок 6-8 недель
900 руб.
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Описание
Thermal Management\Coolers\Heat Sinks
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3°C/W Black Anodized
Технические параметры
| Attachment Method | Tape |
| Automotive | Unknown |
| Device Cooled | BGA|FPGA |
| ECCN (US) | EAR99 |
| Fin Style | Pin Array |
| Finish | Black Anodized |
| Material | Aluminum |
| Mounting | Adhesive |
| Part Status | Active |
| PPAP | Unknown |
| Thermal Resistance | 20.3°C/W |
| Type | Passive |
| ECCN | EAR99 |
| Height Off Base (Height of Fin) | 0.709"" (18.00mm) |
| HTSUS | 8473.30.5100 |
| Length | 1.063"" (27.00mm) |
| Material Finish | Black Anodized |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Package | Bulk |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | 4.0W @ 80В°C |
| RoHS Status | RoHS Compliant |
| Shape | Square, Pin Fins |
| Thermal Resistance @ Forced Air Flow | 6.50В°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 20.30В°C/W |
| Width | 1.063"" (27.00mm) |
| Brand: | Aavid |
| Color: | Black |
| Designed for: | BGA |
| Factory Pack Quantity: Factory Pack Quantity: | 540 |
| Fin Style: | Omnidirectional Fin |
| Heatsink Material: | Aluminum |
| Manufacturer: | Aavid |
| Mounting Style: | Adhesive |
| Part # Aliases: | 306218 |
| Product Category: | Heat Sinks |
| Product Type: | Heatsinks |
| Product: | Heatsinks |
| Series: | Plastic BGA |
| Subcategory: | Heatsinks |
| Thermal Resistance: | 20.3 C/W |
Техническая документация
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