HDTM-3-08-1-S-VT-0-1, High Speed / Modular Connectors XCede HD 1.80 mm High-Density Backplane Vertical Header
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см. техническую документацию
см. техническую документацию
34 шт., срок 7-9 недель
2 870 руб.
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2 470 руб.
от 25 шт. —
2 050 руб.
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Описание
Connectors\Backplane Connectors\High Speed / Modular Connectors
XCede® HD High-Density Backplane SystemsSamtec XCede ® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for the creation of a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. The XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.
Технические параметры
| Brand: | Samtec |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Factory Pack Quantity: Factory Pack Quantity: | 60 |
| Housing Color: | Black |
| Housing Material: | Liquid Crystal Polymer(LCP) |
| Manufacturer: | Samtec |
| Maximum Operating Temperature: | +105 C |
| Minimum Operating Temperature: | -40 C |
| Mounting Angle: | Vertical |
| Number of Positions: | 48 Position |
| Number of Rows: | 8 Row |
| Packaging: | Tray |
| Pitch: | 1.8 mm |
| Product Category: | High Speed/Modular Connectors |
| Product Type: | High Speed/Modular Connectors |
| Product: | Headers |
| Series: | HDTM |
| Subcategory: | Backplane Connectors |
| Termination Style: | Press Fit |
| Tradename: | XCede |
| Вес, г | 5.56 |
Техническая документация
Datasheet
pdf, 750 КБ
Сроки доставки
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