W949D6DBHX5I, DRAM 512Mb LPDDR, x16, 200MHz, Industrial Temp, 46nm
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Описание
Semiconductors\Memory ICs\DRAM
DRAM Product PortfolioWinbond DRAM Product Portfolio consists of Mobile RAM and Specialty DRAM for consumer, communication, peripheral, industrial, and automobile markets. Specialty DRAM features high performance and high speed for a complete solution. SDR, DDR, DDR2, and DDR3 feature support for industrial and automotive applications with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advice to KGD customers, including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test, and more.
Технические параметры
| Access Time: | 6.5 ns |
| Brand: | Winbond |
| Data Bus Width: | 16 bit |
| Factory Pack Quantity: Factory Pack Quantity: | 312 |
| Manufacturer: | Winbond |
| Maximum Clock Frequency: | 200 MHz |
| Maximum Operating Temperature: | +85 C |
| Memory Size: | 512 Mbit |
| Minimum Operating Temperature: | -40 C |
| Moisture Sensitive: | Yes |
| Mounting Style: | SMD/SMT |
| Organization: | 32 M x 16 |
| Package / Case: | VFBGA-60 |
| Product Category: | DRAM |
| Product Type: | DRAM |
| Series: | W949D6DB |
| Subcategory: | Memory & Data Storage |
| Supply Current - Max: | 40 mA |
| Supply Voltage - Max: | 1.95 V |
| Supply Voltage - Min: | 1.7 V |
| Type: | SDRAM Mobile-LPDDR |
| Address Bus Width | 15bit |
| Data Bus Width | 16bit |
| Data Rate | 200MHz |
| Maximum Operating Supply Voltage | 1.95 V |
| Maximum Operating Temperature | +85 °C |
| Maximum Random Access Time | 5ns |
| Memory Size | 512Mbit |
| Minimum Operating Supply Voltage | 1.7 V |
| Minimum Operating Temperature | -40 °C |
| Mounting Type | Surface Mount |
| Number of Bits per Word | 8bit |
| Number of Words | 64M |
| Organisation | 64M x 8 bit |
| Package Type | VFBGA |
| Pin Count | 60 |
| SDRAM Class | LPDDR |
| Width | 8.1mm |
| Automotive | No |
| Chip Density (bit) | 512M |
| DRAM Type | Mobile LPDDR SDRAM |
| ECCN (US) | EAR99 |
| EU RoHS | Compliant |
| Interface Type | LVCMOS |
| Lead Shape | Ball |
| Maximum Access Time (ns) | 6.5|5 |
| Maximum Clock Rate (MHz) | 200 |
| Maximum Operating Supply Voltage (V) | 1.95 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Minimum Operating Temperature (°C) | -40 |
| Mounting | Surface Mount |
| Number of Bits/Word (bit) | 16 |
| Number of I/O Lines (bit) | 16 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 8M |
| Operating Current (mA) | 75 |
| Organization | 32Mx16 |
| Part Status | Active |
| PCB changed | 60 |
| PPAP | No |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| Supplier Temperature Grade | Industrial |
| Вес, г | 1.89 |
Техническая документация
Дополнительная информация
Калькуляторы группы «Микросхемы памяти»
Типы корпусов импортных микросхем
Сроки доставки
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