HSS-B20-061H, Heat Sinks 38.1 x 12.8 x 12.7mm TO-220 solder pin
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1400 шт., срок 7-9 недель
220 руб.
от 10 шт. —
200 руб.
от 25 шт. —
184 руб.
от 50 шт. —
174.51 руб.
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на сумму 220 руб.
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Описание
Thermal Management\Heat Sinks
Thermal Management SolutionsCUI Devices Thermal Management Solutions are vital to system performance by reducing unwanted heat. CUI Devices Thermal Management line addresses the increasing thermal challenges in today's board-level electronic applications, encompassing a range of DC axial fans, blowers, heat sinks, Peltier thermoelectric cooling (TEC) devices, and thermal accessories.
Технические параметры
| Brand: | CUI Devices |
| Color: | Black |
| Designed for: | TO-220 |
| Factory Pack Quantity: Factory Pack Quantity: | 500 |
| Fin Style: | Formed Fin |
| Heatsink Material: | Aluminum |
| Manufacturer: | CUI Devices |
| Mounting Style: | Panel |
| Packaging: | Bulk |
| Product Category: | Heat Sinks |
| Product Type: | Heatsinks |
| Product: | Heatsinks |
| Subcategory: | Heatsinks |
| Thermal Resistance: | 23.05 C/W |
| Type: | Plate |
| Attachment Method | PC Pin |
| ECCN | EAR99 |
| Height Off Base (Height of Fin) | 0.500"" (12.70mm) |
| HTSUS | 8473.30.5100 |
| Length | 1.500"" (38.10mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Package | Box |
| Package Cooled | TO-220 |
| Power Dissipation @ Temperature Rise | 4.0W @ 75В°C |
| RoHS Status | RoHS Compliant |
| Series | HSS -> |
| Shape | Rectangular, Fins |
| Thermal Resistance @ Forced Air Flow | 5.01В°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 18.63В°C/W |
| Type | Board Level, Vertical |
| Width | 0.504"" (12.80mm) |
| Вес, г | 3.1 |
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