HSS-B20-NP-15, Heat Sinks 19 x 22 x 11.2mm TO-220 slide in
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170 шт., срок 6-8 недель
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Описание
Thermal Management\Heat Sinks
Heat SinksCUI Devices Board Level and BGA Heat Sinks are designed to dissipate heat in natural convection and forced air environments. This line of aluminum and copper heat sinks from CUI Devices offers a variety of form factors and package types to meet users' onboard cooling needs.
Технические параметры
| Brand: | CUI Devices |
| Color: | Black |
| Designed for: | TO-220 |
| Factory Pack Quantity: Factory Pack Quantity: | 500 |
| Fin Style: | Formed Fin |
| Heatsink Material: | Aluminum |
| Manufacturer: | CUI Devices |
| Mounting Style: | Panel |
| Packaging: | Bulk |
| Product Category: | Heat Sinks |
| Product Type: | Heatsinks |
| Product: | Heatsinks |
| Subcategory: | Heatsinks |
| Thermal Resistance: | 23.32 C/W |
| Type: | Plate |
| ECCN | EAR99 |
| Height Off Base (Height of Fin) | 0.440"" (11.18mm) |
| HTSUS | 8473.30.5100 |
| Length | 0.625"" (15.90mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Package | Bag |
| Package Cooled | TO-220 |
| Power Dissipation @ Temperature Rise | 4.1W @ 75В°C |
| RoHS Status | RoHS Compliant |
| Series | HSS -> |
| Shape | Rectangular, Fins |
| Thermal Resistance @ Forced Air Flow | 6.50В°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 18.34В°C/W |
| Type | Board Level |
| Width | 0.866"" (22.00mm) |
| Вес, г | 2.9 |
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