28-6554-11, IC & Component Sockets 28 PIN W/HANDLE
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48 шт., срок 7-9 недель
5 990 руб.
от 9 шт. —
4 870 руб.
от 27 шт. —
4 470 руб.
Добавить в корзину 1 шт.
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Описание
Connectors\IC & Component Sockets
28 (2 x 14) Pos DIP, ZIF (ZIP), 0,6 дюйма (15,24 мм) Межрядное гнездо, сквозное отверстие под золото
Технические параметры
| Brand: | Aries Electronics |
| Case Style: | DIP |
| Contact Material: | Beryllium Copper |
| Contact Plating: | Gold |
| Current Rating: | 1 A |
| Factory Pack Quantity: Factory Pack Quantity: | 9 |
| Features: | Universal ZIF DIP |
| Flammability Rating: | UL 94 V-0 |
| Housing Material: | Polyphenylene Sulfide(PPS) |
| Manufacturer: | Aries Electronics |
| Maximum Operating Temperature: | +150 C |
| Minimum Operating Temperature: | -65 C |
| Mounting Style: | Through Hole |
| Number of Positions: | 28 Position |
| Number of Rows: | 2 Row |
| Pitch: | 2.54 mm |
| Product Category: | IC & Component Sockets |
| Product Type: | IC & Component Sockets |
| Product: | Zero Insertion Force(ZIF)Sockets |
| Row Spacing: | 15.24 mm |
| Series: | X55X |
| Subcategory: | IC & Component Sockets |
| Termination Style: | Solder Tail |
| Type: | DIP Socket |
| Voltage Rating: | 1 kVAC |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1A |
| ECCN | EAR99 |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| HTSUS | 8536.69.4040 |
| Material Flammability Rating | UL94 V-0 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Package | Bulk |
| Pitch - Mating | 0.100"" (2.54mm) |
| Pitch - Post | 0.100"" (2.54mm) |
| REACH Status | REACH Unaffected |
| RoHS Status | ROHS3 Compliant |
| Termination | Solder |
| Termination Post Length | 0.110"" (2.78mm) |
| Type | DIP, ZIF (ZIP), 0.6"" (15.24mm) Row Spacing |
| Body Orientation | Straight |
| Contact Material | Beryllium Copper |
| Contact Plating | Gold over Nickel |
| Current Rating | 1.0A |
| Gender | Female |
| Number of Contacts | 28 |
| Number of Rows | 2 |
| Package Type | DIP |
| Pitch | 2.54mm |
| Socket Mounting Type | Through Hole |
| Termination Method | Solder |
| Вес, г | 32.66 |
Техническая документация
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