53307-2671, Board to Board & Mezzanine Connectors 0.8 BtB WaferAssy ST SMT 26Ckt EmbsTpPkg
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см. техническую документацию
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Описание
Connectors\Board to Board & Mezzanine Connectors
Augmented RealityAugmented Reality (AR) can go beyond video games and offer advantages to various industries. AR improves both safety and efficiency and allows engineers freedom from physical constraints, and Molex solutions keep electronic designs secure and electrical connections reliable. Discover new realities in augmented reality and examine the key products empowering companies to develop AR products and technologies that are enhancing human capabilities in manufacturing applications.
Технические параметры
| Brand: | Molex |
| Contact Plating: | Tin |
| Current Rating: | 500 mA |
| Factory Pack Quantity: Factory Pack Quantity: | 1000 |
| Housing Material: | Thermoplastic(TP) |
| Manufacturer: | Molex |
| Maximum Operating Temperature: | +105 C |
| Minimum Operating Temperature: | -40 C |
| Mounting Angle: | Vertical |
| Number of Positions: | 26 Position |
| Number of Rows: | 2 Row |
| Part # Aliases: | 0533072671 |
| Pitch: | 0.8 mm |
| Product Category: | Board to Board & Mezzanine Connectors |
| Product Type: | Board to Board & Mezzanine Connectors |
| Series: | 53307 |
| Subcategory: | Board to Board & Mezzanine Connectors |
| Termination Style: | Solder |
| Tradename: | SlimStack |
| Voltage Rating: | 50 V |
| Вес, г | 0.36 |
Техническая документация
Datasheet
pdf, 34 КБ
