ADM00309, Daughter Cards & OEM Boards MSOP-10 and MSOP-8 Bondout Board
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см. техническую документацию
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Описание
Embedded Solutions\Engineering Tools\Embedded Tools & Accessories\Daughter Cards & OEM Boards
Smart (Effortless Embedded Control Solutions)Microchip Technology Effortless Embedded Control Solutions allow developers to effortlessly meet the ever-changing requirements of modern electronics with a portfolio of scalable 8-bit, 16-bit, and 32-bit microcontrollers, digital signal controllers, and microprocessors. Flexible peripherals and functions make creating differentiated applications that set you apart from your competition easy. Intuitive design environments and visual configuration tools provide a straightforward getting-started experience while proven reference designs and professionally tested software libraries lower your design risk.
Технические параметры
| Brand: | Microchip Technology |
| Description/Function: | MSOP-10 and MSOP-8 bondout board |
| Factory Pack Quantity: Factory Pack Quantity: | 1 |
| For Use With: | MSOP-8, MSOP-10, DIP-10 |
| Manufacturer: | Microchip |
| Product Category: | Daughter Cards & OEM Boards |
| Product Type: | Daughter Cards & OEM Boards |
| Product: | Evaluation Boards |
| Subcategory: | Embedded Solutions |
| Tool Is For Evaluation Of: | MSOP-8, MSOP-10, DIP-10 |
| Base Product Number | ADM00309 -> |
| ECCN | EAR99 |
| Embedded | No |
| HTSUS | 8473.30.1180 |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Package | Bulk |
| REACH Status | REACH Unaffected |
| RoHS Status | ROHS3 Compliant |
| Supplied Contents | Unpopulated (Bare) Board(s) |
| Utilized IC / Part | 8-MSOP, 10-DIP, 10-MSOP |
| Вес, г | 238.4 |
Техническая документация
Datasheet
pdf, 2680 КБ
Datasheet ADM00309
pdf, 76 КБ
