DEVKIT-COMM
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см. техническую документацию
см. техническую документацию
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Описание
Embedded Solutions\Engineering Tools\Embedded Tools & Accessories\Daughter Cards & OEM Boards
DEVKIT-COMM Expansion BoardNXP Semiconductors DEVKIT-COMM Expansion Board for Ultra-Reliable MCUs Development Kits is a shield that connects to NXP Ultra-Reliable MCUs Development Kits to enhance the capabilities of the kit. The NXP Semiconductors DEVKIT-COMM Expansion Board supports up to four additional Controller Area Network (CAN) connections and six additional Local Interconnect Network (LIN)/SCI connections.
Технические параметры
| Brand: | NXP Semiconductors |
| Description/Function: | CAN/LIN communications expansion |
| Factory Pack Quantity: Factory Pack Quantity: | 1 |
| Interface Type: | CAN, LIN/SCI |
| Manufacturer: | NXP |
| Maximum Operating Temperature: | +125 C |
| Minimum Operating Temperature: | -40 C |
| Operating Supply Voltage: | 12 V |
| Part # Aliases: | 935329169598 |
| Product Category: | Daughter Cards & OEM Boards |
| Product Type: | Daughter Cards & OEM Boards |
| Product: | Development Boards |
| Subcategory: | Embedded Solutions |
| Tool Is For Evaluation Of: | TJA1022TK, TJA1048TK |
| Вес, г | 0.01 |
