5023820370
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250 руб.
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Описание
Электроэлемент
Conn Wire to Board RCP 3 POS 1.25mm Solder ST SMD Embossed T/R (Alt: 5023820370)
Технические параметры
| Brand | Molex |
| Contact Gender | Socket(Female) |
| Contact Material | Copper Alloy |
| Contact Plating | Tin |
| Current Rating | 1 A |
| Factory Pack Quantity | 1400 |
| Housing Material | Thermoplastic |
| Manufacturer | Molex |
| Mounting Angle | Straight |
| Mounting Style | SMD |
| Number of Positions | 3 Position |
| Number of Rows | 1 Row |
| Packaging | Reel |
| Pitch | 1.25 mm |
| Product | Headers |
| Product Category | Headers Wire Housings |
| RoHS | Details |
| Series | 502382 |
| Termination Style | SMD |
| Tradename | CLIK-Mate |
| Type | Receptacle Housing |
| Unit Weight | 0.007436 oz |
| Voltage Rating | 50 VAC/DC |
| Mounting Type | Surface Mount |
| Number of Contacts | 3 |
| Applications | Automotive, General Purpose, Industrial, Lighting, Medical |
| Connector Type | Receptacle |
| Contact Finish - Mating | Tin |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 39.4Вµin(1.00Вµm) |
| Contact Finish Thickness - Post | 39.4Вµin(1.00Вµm) |
| Contact Length - Post | - |
| Contact Shape | - |
| Contact Type | Forked |
| Current Rating (Amps) | 1A |
| Fastening Type | Latch Holder |
| Features | Solder Retention |
| Ingress Protection | - |
| Insulation Color | Natural |
| Insulation Height | 0.173"(4.40mm) |
| Insulation Material | Resin |
| Mated Stacking Heights | - |
| Material Flammability Rating | UL94 V-0 |
| Number of Positions Loaded | All |
| Operating Temperature | -40В°C ~ 105В°C |
| Part Status | Active |
| Pitch - Mating | 0.049"(1.25mm) |
| Row Spacing - Mating | - |
| Style | Board to Cable/Wire |
| Termination | Solder |
| Вес, г | 0.2108 |
Техническая документация
Документация
pdf, 32 КБ
