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CP Thermoelectric Modules w/ Sealant - EXPANSION
Laird has expanded its CP Series to include Thermoelectric Modules with Epoxy and RT sealants. The Epoxy version features a low-density syntactic foam epoxy encapsulant with a temperature range of -55°C to 150°C and the RT version has a non-corrosive, silicone adhesive sealant with a temperature range of -60°C to 204°C. Known as 'the standard' in the thermoelectric industry, the Laird CP Series consists of high-performance and highly reliable Thermoelectric Modules (TEMs) available in numerous heat pumping capacities, geometric shapes, geometric sizes, and input power ranges. Constructed using Bismuth Telluride semiconductor material and thermally conductive aluminum oxide ceramics, the Laird Technologies CP Series Thermoelectric Modules feature precise temperature control and reliable solid state operation. Designed for higher current and large heat-pumping applications, the Laird CP Series TEMs are ideally suited for applications such as medical lasers, lab science instrumentation, clinical diagnostic systems, photonics laser systems, electronic enclosure cooling, food and beverage cooling, and chillers (liquid cooling). RoHS Compliant and environmentally friendly.