2226880-1, CONN KIT RCPT BACKPLANE MT V66.4

Ruggedized Optical Backplane Interconnect System

TE Connectivity's (TE) Ruggedized Optical Backplane Interconnect System provides a high-density, blind-mate optical interconnect in a backplane / daughtercard configuration. The system meets VITA 66.1 and 66.4 standards with full-size or half-size modules. The VITA 66.1 modules are full width and accommodate two MT ferrules while the VITA 66.4 modules are half width and hold a single MT ferrule. Two modules can be fit into the same space as a VITA 66.1 modules. The plug (daughtercard) connector housing utilizes a slot feature to facilitate cleaning the MT interfaces, and locating post features helps ensure a proper position on the backplane and daughtercard. These connectors are designed to maximize optical performance. Typical applications for TE Ruggedized Optical Backplane Interconnect System are embedded computing, avionics and vetronics, secure communications, radar, processing, and imaging and targeting.