HSB05-171711
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см. техническую документацию
см. техническую документацию
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Описание
Heat Sinks
CUI Devices Board Level and BGA Heat Sinks are designed to dissipate heat in natural convection and forced air environments. This line of aluminum and copper heat sinks from CUI Devices offers a variety of form factors and package types to meet users' onboard cooling needs.
CUI Devices Board Level and BGA Heat Sinks are designed to dissipate heat in natural convection and forced air environments. This line of aluminum and copper heat sinks from CUI Devices offers a variety of form factors and package types to meet users' onboard cooling needs.
Технические параметры
| Brand: | CUI Devices |
| Color: | Black |
| Designed for: | BGA |
| Factory Pack Quantity: Factory Pack Quantity: | 1960 |
| Fin Style: | Vertical Fin |
| Heatsink Material: | Aluminum Alloy |
| Manufacturer: | CUI Devices |
| Mounting Style: | Adhesive |
| Packaging: | Box |
| Product Category: | Heat Sinks |
| Product Type: | Heatsinks |
| Product: | Heatsinks |
| Subcategory: | Heatsinks |
| Thermal Resistance: | 29.1 C/W |
Техническая документация
Datasheet
pdf, 295 КБ
Сроки доставки
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